Gemelos Vehiculares Multifísicos de Alta Fidelidad y Co-Simulación FMI 3.0

AutomotiveTwin conecta modelos físicos independientes en un gemelo digital unificado usando el estándar FMI 3.0. Al simular fuerzas térmicas, eléctricas y mecánicas en tiempo real, permite estimar la vida útil de componentes y validar el tren motriz.

Superando Silos de Ingeniería mediante Unidades de Mock-up Funcionales Estandarizadas

La ingeniería vehicular suele segregar la aerodinámica CFD, la dinámica estructural y los modelos de batería en herramientas aisladas. AutomotiveTwin conecta estos entornos compilando dominios en FMUs, permitiendo simular baterías y motores a velocidades de hardware en el bucle protegiendo la propiedad intelectual.

Core Engineering Areas

• Functional Mock-up Interface (FMI) — Standardizing FMU 3.0 wrappers across mechanical, electrical, thermal, and software domains to execute cohesive vehicle simulations.
• Thermal-Electrochemical Coupling — Simulating microscopic ion intercalation alongside macroscopic coolant jacket heat transfer to predict cell degradation during track driving.
• Electromagnetic & NVH Twin — Computing space-time Maxwell stress tensors across stator laminations to optimize psychoacoustic cabin comfort in electric vehicles.

Technical Articles

• Next-Generation Multi-Physics Co-Simulation with FMI 3.0
• Mitigating High-Frequency Motor Whine Through Digital Twin Co-Design

Related Cluster Architecture Specifications

• AutomotiveSDV — Full SDV Stack & Reference Architecture
• A2HCard — Agent-to-Human (A2H) Interface Cards & In-Cabin Autonomous Interaction Manifests
• A2HumanCard — Standardized In-Vehicle AI Agent Capability Discovery, Trust & Authorization Cards
• AIDrivenSynBio — AI-Driven Synthetic Biology for Automotive In-Cabin Air Purification, Bio-Engineered Pathogen Scavengers & Molecular Biosensors